LT3466
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ± 0.05
R = 0.115
TYP
6
10
0.38 ± 0.10
3.50 ± 0.05 1.65 ± 0.05
2.15 ± 0.05 (2 SIDES)
PACKAGE
PIN 1
TOP MARK
3.00 ± 0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
OUTLINE
(SEE NOTE 6)
(DD10) DFN 1103
0.25 ± 0.05
0.50
0.200 REF
0.75 ± 0.05
5
1
0.25 ± 0.05
0.50 BSC
BSC
2.38 ± 0.10
2.38 ± 0.05
(2 SIDES)
0.00 – 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
4.90 – 5.10*
3.58
(.141)
(.193 – .201)
3.58
(.141)
16 1514 13 12 11 10
9
6.60 ± 0.10
2.94
2.94
4.50 ± 0.10
SEE NOTE 4
(.116)
0.45 ± 0.05
6.40
(.116) (.252)
BSC
1.05 ± 0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7 8
1.10
4.30 – 4.50*
(.169 – .177)
0.25
REF
0 ° – 8 °
(.0433)
MAX
0.65
0.09 – 0.20
0.50 – 0.75
(.0256)
0.05 – 0.15
(.0035 – .0079)
(.020 – .030)
BSC
0.195 – 0.30
(.0077 – .0118)
(.002 – .006)
FE16 (BB) TSSOP 0204
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
TYP
4. RECOMMENDED MINIMUM PCB METAL SIZE
2. DIMENSIONS ARE IN
MILLIMETERS
(INCHES)
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
3. DRAWING NOT TO SCALE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3466fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
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